The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2020
Filed:
Mar. 17, 2016
Applicant:
The Texas A&m University System, College Station, TX (US);
Inventors:
Mustafa Akbulut, College Station, TX (US);
Cengiz Yegin, College Station, TX (US);
Nirup K. Nagabandi, College Station, TX (US);
Blake Teipel, College Station, TX (US);
Assignee:
THE TEXAS A&M UNIVERSITY SYSTEM, College Station, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 13/00 (2006.01); C25D 15/00 (2006.01); C25D 3/38 (2006.01); C25D 7/00 (2006.01); H01L 23/373 (2006.01); H01L 23/42 (2006.01); B32B 9/00 (2006.01); C09K 5/14 (2006.01); H05K 7/20 (2006.01); B82Y 30/00 (2011.01); B82Y 40/00 (2011.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
C25D 15/00 (2013.01); B32B 9/00 (2013.01); C09K 5/14 (2013.01); C25D 3/38 (2013.01); C25D 7/00 (2013.01); F28F 13/00 (2013.01); H01L 23/3731 (2013.01); H01L 23/3736 (2013.01); H01L 23/42 (2013.01); H05K 7/2039 (2013.01); B82Y 30/00 (2013.01); B82Y 40/00 (2013.01); F28F 2013/001 (2013.01); H01L 23/3733 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/27462 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29209 (2013.01); H01L 2224/29239 (2013.01); H01L 2224/29247 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/1432 (2013.01); Y10S 977/755 (2013.01); Y10S 977/778 (2013.01); Y10S 977/90 (2013.01); Y10S 977/932 (2013.01);
Abstract
Inefficient dissipation of heat limits the performance of electronic devices. Thermal interface materials (TIMs) can be used in electronic devices to dissipate heat more effectively and efficiently. Nanocomposites have been prepared using functionalized boron nitride nanosheets (BNNS). The incorporation of soft-ligand functionalized BNNS in a metal matrix was used to nanofabricate kinetically-trapped nanocomposites TIMs.