The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2020
Filed:
Dec. 07, 2016
Applicant:
Dowa Thermotech Co., Ltd., Tokyo, JP;
Inventors:
Hiroki Tashiro, Aichi, JP;
Hiroyuki Matsuoka, Aichi, JP;
Wataru Sakakibara, Aichi, JP;
Soichiro Nogami, Gunma, JP;
Satoru Habuka, Aichi, JP;
Assignee:
DOWA THERMOTECH CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/06 (2006.01); B32B 9/00 (2006.01); C23C 28/00 (2006.01); C23C 14/00 (2006.01); C23C 16/02 (2006.01); C23C 16/26 (2006.01); C23C 14/34 (2006.01); C23C 16/27 (2006.01); C23C 14/16 (2006.01); C23C 16/50 (2006.01);
U.S. Cl.
CPC ...
C23C 14/0635 (2013.01); B32B 9/00 (2013.01); C23C 14/0057 (2013.01); C23C 14/165 (2013.01); C23C 14/34 (2013.01); C23C 16/029 (2013.01); C23C 16/26 (2013.01); C23C 16/27 (2013.01); C23C 16/50 (2013.01); C23C 28/322 (2013.01); C23C 28/341 (2013.01); C23C 28/343 (2013.01); C23C 28/36 (2013.01);
Abstract
In an intermediate layer formed between a base material and a DLC layer, a Ti layer and a TiC layer formed on a surface of the Ti layer are provided, and a carbon content of the entire layer containing the Ti layer and the TiC layer is 53 at % or more and 77 at % or less.