The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2020

Filed:

Mar. 18, 2016
Applicant:

Loughborough University, Loughborough, GB;

Inventors:

Mark Andrew Ashworth, Nuneaton, GB;

Helen Elizabeth Pearson, Swadlincote, GB;

Xujin Bao, Loughborough, GB;

Geoffrey David Wilcox, Long Eaton, GB;

Assignee:

LOUGHBOROUGH UNIVERSITY, Loughborough, GB;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 7/00 (2006.01); C09D 7/40 (2018.01); C09D 5/00 (2006.01); H05K 3/28 (2006.01); C09D 7/61 (2018.01); C09D 7/62 (2018.01); C09D 175/04 (2006.01); C08K 3/34 (2006.01); C08K 9/02 (2006.01); C08K 9/04 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C09D 7/70 (2018.01); C09D 5/00 (2013.01); C09D 7/61 (2018.01); C09D 7/62 (2018.01); C09D 175/04 (2013.01); H05K 3/28 (2013.01); H05K 3/285 (2013.01); C08K 3/346 (2013.01); C08K 7/00 (2013.01); C08K 9/02 (2013.01); C08K 9/04 (2013.01); C08K 2201/004 (2013.01); C08K 2201/005 (2013.01); C08K 2201/011 (2013.01); H05K 1/0373 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0245 (2013.01); H05K 2201/0769 (2013.01); H05K 2201/09872 (2013.01);
Abstract

A nanocomposite coating composition for use in the mitigation of whisker growth from a metallic surface () includes a polymer matrix () comprising a base polymer and insulating material nanoplatelets (), for example clay nanoplatelets, within the polymer matrix (). A conformal coating () for application to a metal surface () is formed from the coating composition. The conformal coating mitigates the spontaneous growth of whiskers (), in particular tin whiskers, from the coated surface (), reducing the risk of short-circuits caused by such whiskers bridging gaps within electronic devices. Methods are provided for the preparation of coating compositions and coatings.


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