The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2020
Filed:
Jun. 21, 2016
Matsumoto Yushi-seiyaku Co., Ltd., Yao-shi, Osaka, JP;
MATSUMOTO YUSHI-SEIYAKU CO., LTD., Osaka, JP;
Abstract
A process for producing heat-expandable microspheres which enables constant and high-yield production of heat-expandable microspheres having a mean particle size ranging from 0.01 to 10 μm without deteriorating their expansion performance, and the application thereof. The process produces heat-expandable microspheres containing a thermoplastic resin shell and the blowing agent encapsulated therein. The process includes a step of dispersing a polymerizable component and the blowing agent in an aqueous dispersion medium containing a polyester amide having an acid value (mgKOH/g) ranging from 95 to 140 and a step of polymerizing the polymerizable component.