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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10731002 B1

PDFFull Text
Date of Patent:
Aug. 04, 2020

Filed:

Mar. 29, 2017

Semiaromatic copolyamide resin and polyamide molding composition consisting of the same

Applicants:

Kingfa Sci. & Tech. Co., Ltd., Guangdong, CN;

Zhuhai Vanteque Specialty Engineering Plastics Co., Ltd., Guangdong, CN;

Shanghai Kingfa Sci. & Tech. Dvpt. Co., Ltd., Shanghai, CN;

Inventors:

Chuanhui Zhang, Guangdong, CN;

Min Cao, Guangdong, CN;

Sujun Jiang, Guangdong, CN;

Zhenguo Shi, Guangdong, CN;

Xueke Sun, Guangdong, CN;

Liming Fan, Guangdong, CN;

Mingqin Chen, Guangdong, CN;

Mujun Huang, Guangdong, CN;

Xianbo Huang, Guangdong, CN;

Assignees:

KINGFA SCI. & TECH. CO., LTD., Guangdong, CN;

ZHUHAI VANTEQUE SPECIALTY ENGINEERING PLASTICS CO., LTD., Guangdong, CN;

SHANGHAI KINGFA SCI. & TECH. DVPT. CO., LTD., Shanghai, CN;

Attorney:

JCIPRNET

Primary Examiner:

Stephen E Rieth

Int. Cl.
CPC ...
C08G 69/36 (2006.01); C08L 77/02 (2006.01); C08G 69/14 (2006.01); C08G 69/12 (2006.01); C08L 77/10 (2006.01); C08G 69/16 (2006.01); C08K 7/14 (2006.01); C08J 5/04 (2006.01); C08L 77/00 (2006.01); C08J 5/00 (2006.01); C08K 3/34 (2006.01); C08K 5/5313 (2006.01); C08K 13/02 (2006.01);
U.S. Cl.
CPC ...
C08G 69/36 (2013.01); C08G 69/12 (2013.01); C08G 69/14 (2013.01); C08G 69/16 (2013.01); C08J 5/005 (2013.01); C08J 5/04 (2013.01); C08J 5/043 (2013.01); C08K 3/34 (2013.01); C08K 5/5313 (2013.01); C08K 7/14 (2013.01); C08K 13/02 (2013.01); C08L 77/00 (2013.01); C08L 77/02 (2013.01); C08L 77/10 (2013.01); C08J 2377/02 (2013.01); C08J 2377/10 (2013.01); C08J 2423/22 (2013.01); C08K 2003/343 (2013.01); C08K 2201/003 (2013.01); C08K 2201/004 (2013.01); C08K 2201/016 (2013.01); C08L 2201/02 (2013.01); C08L 2201/08 (2013.01);
Abstract

A semiaromatic copolyamide resin and a polyamide molding composition consisting of the same are provided, consisting of following repeat units: (A) 26-80 mol % of units derived from para-amino benzoic acid; (B) 4-70 mol % of units derived from 11-aminoundecanoic acid or undecanolactam, and 0-70 mol % of units derived from another amino acids having 6 to 36 carbon atoms or units consisting of a lactam having 6-36 carbon atoms; (C) 0-37 mol % of units derived from a diamine unit having 4 to 36 carbon atoms; and (D) 0-37 mol % of units derived from a diacid unit having 6 to 36 carbon atoms; wherein, (A)+(B)+(C)+(D)=100 mol %; and molar contents of the units derived from para-amino benzoic acid and those derived from 11-aminoundecanoic acid or undecanolactam are not equal to 50 mol % simultaneously.

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