The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2020

Filed:

Jun. 23, 2017
Applicant:

Hamilton Sundstrand Corporation, Charlotte, NC (US);

Inventors:

Sergey Mironets, Charlotte, NC (US);

William Louis Wentland, Rockford, IL (US);

Diana Giulietti, Weatogue, CT (US);

Colette Opsahl Fennessy, West Hartford, CT (US);

Assignee:

Hamilton Sundstrand Corporation, Charlotte, NC (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/00 (2014.01); B33Y 50/02 (2015.01); B33Y 10/00 (2015.01); B22F 5/00 (2006.01); B33Y 80/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/00 (2015.01); B22F 3/105 (2006.01); B23K 26/50 (2014.01);
U.S. Cl.
CPC ...
B33Y 50/02 (2014.12); B22F 3/1055 (2013.01); B22F 5/009 (2013.01); B23K 26/50 (2015.10); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/00 (2014.12); B33Y 80/00 (2014.12); B22F 2003/1056 (2013.01); B22F 2998/10 (2013.01);
Abstract

An example method of making a component includes providing a digital model of a component to a software program, the software program operable to slice the digital model into digital layers and raster each digital layer into digital segments, the digital segments delineated by digital raster lines. The method further includes depositing a first layer of powdered material onto a platform, compacting the first layer of powered material into a first compacted layer, sintering the first compacted layer along lines corresponding to the digital raster lines using a laser, wherein the laser operates at a first power and a first scan speed, and sintering the first compacted layer along a perimeter of the first compacted layer using the laser to form a first unitary layer, wherein the laser operates at a second power and a second scan speed, wherein the ratio of the first power to the second power is less than about 3. An apparatus for making a component is also disclosed.


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