The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2020

Filed:

Jun. 30, 2017
Applicant:

Dow Global Technologies Llc, Midland, MI (US);

Inventors:

Wenyi Huang, Midland, MI (US);

Jeffrey D. Wenzel, Saginaw, MI (US);

Jie Feng, Midland, MI (US);

Robert E. Wrisley, Clare, MI (US);

Hyunwoo Kim, Midland, MI (US);

Kurt A. Koppi, Midland, MI (US);

Scott R. Kaleyta, Saginaw, MI (US);

Thomas J. Parsons, Midland, MI (US);

Nicolas Cardoso Mazzola, Jundiai, BR;

Harpreet Singh, Pearland, TX (US);

Assignee:

Dow Global Technologies LLC, Midland, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/30 (2006.01); B29C 48/30 (2019.01); B29C 48/305 (2019.01); B29C 48/07 (2019.01); B29C 48/08 (2019.01); B29C 48/19 (2019.01); B29C 48/20 (2019.01); B29C 48/21 (2019.01); B29C 48/86 (2019.01); B29C 48/11 (2019.01); B29C 48/255 (2019.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); B29L 7/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 48/30 (2019.02); B29C 48/07 (2019.02); B29C 48/08 (2019.02); B29C 48/11 (2019.02); B29C 48/19 (2019.02); B29C 48/20 (2019.02); B29C 48/21 (2019.02); B29C 48/255 (2019.02); B29C 48/305 (2019.02); B29C 48/307 (2019.02); B29C 48/865 (2019.02); B32B 27/306 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/365 (2013.01); B29L 2007/002 (2013.01); B29L 2031/756 (2013.01);
Abstract

The present disclosure provides a die assembly for producing a microcapillary film. The die assembly includes a first die plate, a second die plate, a plurality of multi-jackbolt tensioners connecting the first die plate to the second die plate, a manifold, and a plurality of nozzles. The manifold is located between the pair of die plates and defines a plurality of film channels therebetween. The plurality of film channels converge into an elongate outlet, wherein a thermoplastic material is extrudable through the plurality of film channels and the elongate outlet to form a microcapillary film. The plurality of nozzles are located between the plurality of film channels. The plurality of nozzles are operatively connected to a source of channel fluid for emitting the channel fluid between layers of the microcapillary film, whereby a plurality of microcapillary channels are formed in the microcapillary film.


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