The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2020
Filed:
Mar. 06, 2018
Applicants:
Kazuo Hirasawa, Iida, JP;
Kenji Tamura, Nissin, JP;
Inventors:
Kazuo Hirasawa, Iida, JP;
Kenji Tamura, Nissin, JP;
Assignees:
TOYOTA JIDOSHA KABUSHIKI KAISHA, Tokyo-shi, Aichi-ken, JP;
TOKAI KOGYO CO., LTD., Obu, Aichi-Pref, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14549 (2013.01); B29C 45/14065 (2013.01); B29C 45/14819 (2013.01); B29C 2045/14139 (2013.01); B29C 2045/14163 (2013.01); B29C 2045/14606 (2013.01); Y10T 428/1352 (2015.01);
Abstract
An insert molding apparatus includes a forming die in which a first part is arranged, and that molds resin such that a portion of the first part is exposed; and a first mounting part that is arranged at a portion where the first part is exposed, and that has a passage that passes through a space in the forming die into which the molten resin is supplied and a portion where the first part is arranged.