The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2020

Filed:

Dec. 18, 2015
Applicant:

Dentsply Sirona Inc., York, PA (US);

Inventors:

Paul Schnitzspan, Frankfurt, DE;

Volker Wedler, Hirschberg, DE;

Assignee:

DENTSPLY SIRONA Inc., York, PA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61C 8/00 (2006.01); A61C 13/00 (2006.01); A61C 9/00 (2006.01);
U.S. Cl.
CPC ...
A61C 8/0001 (2013.01); A61C 8/0022 (2013.01); A61C 8/0074 (2013.01); A61C 9/004 (2013.01); A61C 13/0003 (2013.01); A61C 13/0004 (2013.01); A61C 9/0006 (2013.01);
Abstract

A method is proposed for ascertaining the spatial positions and orientations of at least two implants anchored in a jaw of a patient, said method having the following steps: 1. An adhesive bond aid is produced that bridges the implants and has negative molds of adhesive caps, wherein the negative molds fit on the adhesive caps if these are affixed to the implants, and wherein the negative molds allow a clearance relative to the adhesive caps. 2. The adhesive caps are affixed to the at least two implants in the jaw of the patient. 3. The adhesive bond aid is positioned over the adhesive caps. 4. The clearance between the adhesive caps and the negative molds is filled with adhesive. 5. The adhesive is cured. 6. The adhesive caps are released from the implants. 7. The obtained adhesion key is removed from the patient.


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