The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2020

Filed:

Sep. 07, 2018
Applicant:

Agc Inc., Chiyoda-ku, JP;

Inventors:

Toru Sasaki, Chiyoda-ku, JP;

Wataru Kasai, Chiyoda-ku, JP;

Assignee:

AGC Inc., Chiyoda-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23F 1/00 (2006.01); H05K 3/46 (2006.01); B32B 27/30 (2006.01); B29C 65/00 (2006.01); H05K 1/03 (2006.01); B32B 37/00 (2006.01); B29C 65/18 (2006.01); B29C 65/48 (2006.01); B29C 65/50 (2006.01); B29C 65/78 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4682 (2013.01); B29C 65/18 (2013.01); B29C 65/4815 (2013.01); B29C 65/5057 (2013.01); B29C 65/7894 (2013.01); B29C 66/034 (2013.01); B29C 66/1122 (2013.01); B29C 66/344 (2013.01); B29C 66/45 (2013.01); B29C 66/71 (2013.01); B29C 66/7352 (2013.01); B29C 66/83411 (2013.01); B29C 66/83413 (2013.01); B29C 66/919 (2013.01); B29C 66/91933 (2013.01); B32B 27/30 (2013.01); B32B 37/00 (2013.01); H05K 1/036 (2013.01); H05K 1/0373 (2013.01); H05K 3/06 (2013.01); H05K 2201/015 (2013.01); H05K 2201/0154 (2013.01); H05K 2203/1545 (2013.01);
Abstract

To stably produce a laminate wherein heat resistant resin layers are laminated on both surfaces of a fluorinated resin layer, by thermal lamination. A process for producing a laminate, which comprises a preliminary heating step of heating, while conveying by a metal rollfor heating and a metal rollfor thermal lamination without pressing in the thickness direction, a temporary laminate wherein heat resistant resin filmsandare laminated on both surfaces of a fluorinated resin filmcontaining a melt-moldable fluorinated resin (A) having at least one type of functional groups selected from the group consisting of a carbonyl group-containing group, a hydroxyl group, an epoxy group and an isocyanate group and after the preliminary heating step, a thermal lamination step of pressing the temporary laminate in the thickness direction, while heating it by metal rollsandfor thermal lamination at a thermal lamination temperature of at least the melting point of the fluorinated resin (A) ant at most 420° C., for bonding.


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