The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2020
Filed:
Nov. 30, 2018
Applicant:
Zf Friedrichshafen Ag, Friedrichshafen, DE;
Inventors:
Wilfried Lassmann, Hirschau, DE;
Jörg Kühnl, Weiherhammer, DE;
Assignee:
ZF FRIEDRICHSHAFEN AG, Friedrichshafen, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 7/20 (2006.01); H05K 3/22 (2006.01); H05K 3/46 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0204 (2013.01); H05K 1/021 (2013.01); H05K 1/0206 (2013.01); H05K 1/0209 (2013.01); H05K 1/0263 (2013.01); H05K 1/0265 (2013.01); H05K 3/222 (2013.01); H05K 3/46 (2013.01); H05K 7/20909 (2013.01); H05K 1/0298 (2013.01); H05K 1/181 (2013.01); H05K 2201/10272 (2013.01); H05K 2201/10363 (2013.01);
Abstract
A printed circuit board () comprises a conductive outer layer () and at least one conductive inner layer (). At least one bus bar () for conducting high current and at least one power semiconductor () for controlling and/or activating the high current are disposed on a side of the outer layer () facing away from the at least one inner layer (). The printed circuit board () allows for a high level of component density while simultaneously providing for effective heat dissipation. Furthermore, the printed circuit board () can be produced economically and flexibly.