The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2020
Filed:
Jan. 11, 2018
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Seyun Kim, Seoul, KR;
Jinhong Kim, Seoul, KR;
Haengdeog Koh, Hwaseong-si, KR;
Doyoon Kim, Hwaseong-si, KR;
Hajin Kim, Hwaseong-si, KR;
Soichiro Mizusaki, Suwon-si, KR;
Minjong Bae, Yongin-si, KR;
Changsoo Lee, Seoul, KR;
SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do, KR;
Abstract
A The heating element structure includes: a conductive metal substrate; a heating layer spaced apart from the conductive metal substrate and configured to generate heat in response to an electrical signal; electrodes in contact with the heating layer and configured to provide the electrical signal to the heating layer; and a first insulating layer on the conductive metal substrate, the first insulating layer comprising a first matrix material and a particle, wherein a difference between a coefficient of thermal expansion (CTE) of the first matrix material and a coefficient of thermal expansion of the particle is about 4×10per Kelvin or less.