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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10727655 B1

PDFFull Text
Date of Patent:
Jul. 28, 2020

Filed:

Mar. 18, 2019

Conduction path

Applicants:

Autonetworks Technologies, Ltd., Mie, JP;

Sumitomo Wiring Systems, Ltd., Mie, JP;

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Yuki Fujimura, Mie, JP;

Ryoya Okamoto, Mie, JP;

Hiroshi Shimizu, Mie, JP;

Assignees:

AUTONETWORKS TECHNOLOGIES, LTD., Mie, JP;

SUMITOMO WIRING SYSTEMS, LTD., Mie, JP;

SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Paresh H Paghadal

Int. Cl.
CPC ...
H02G 3/03 (2006.01); B60R 16/02 (2006.01); H02G 3/38 (2006.01); H01B 9/02 (2006.01); H01B 9/00 (2006.01); H02G 3/10 (2006.01); H02G 3/04 (2006.01); H02G 3/12 (2006.01); H01B 7/00 (2006.01);
U.S. Cl.
CPC ...
H02G 3/03 (2013.01); B60R 16/0215 (2013.01); H01B 9/006 (2013.01); H01B 9/02 (2013.01); H02G 3/38 (2013.01); B60R 16/0207 (2013.01); H01B 7/0045 (2013.01); H02G 3/04 (2013.01); H02G 3/105 (2013.01); H02G 3/128 (2013.01);
Abstract

Provided is a technique that improves the heat dissipation properties of a wire that is arranged in a conduction path. A conduction path has a wire, a routing member that is made of a metal and has a routing groove in which the wire is routed, a bracket that is made of a metal and has a first mounting portion that is mounted to the routing member and has a second mounting portion that is mounted to an electrical connection box, and a heat transfer member that is made of a synthetic resin having a higher heat conductivity than air and is arranged in the routing groove and interposed between the wire and the routing member, in a region that corresponds to a portion of the routing member to which the first mounting portion is mounted.

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