The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2020

Filed:

Nov. 29, 2017
Applicant:

Searete Llc, Bellevue, WA (US);

Inventors:

Pai-Yen Chen, Houston, TX (US);

Tom Driscoll, San Diego, CA (US);

Siamak Ebadi, Redmond, WA (US);

John Desmond Hunt, Seattle, WA (US);

Nathan Ingle Landy, Seattle, WA (US);

Melroy Machado, Seattle, WA (US);

Jay Howard McCandless, Alpine, CA (US);

Milton Perque, Jr., Seattle, WA (US);

David R. Smith, Durham, NC (US);

Yaroslav A. Urzhumov, Bellevue, WA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 9/00 (2006.01); H01Q 21/00 (2006.01); H01Q 9/04 (2006.01); H01P 7/08 (2006.01); H01Q 3/44 (2006.01); H01Q 13/20 (2006.01);
U.S. Cl.
CPC ...
H01Q 21/005 (2013.01); H01P 7/082 (2013.01); H01Q 3/443 (2013.01); H01Q 9/0442 (2013.01); H01Q 9/0407 (2013.01); H01Q 13/20 (2013.01);
Abstract

Surface scattering antennas with lumped elements provide adjustable radiation fields by adjustably coupling scattering elements along a wave-propagating structure. In some approaches, the surface scattering antenna is a multi-layer printed circuit board assembly, and the lumped elements are surface-mount components placed on an upper surface of the printed circuit board assembly. In some approaches, the scattering elements are adjusted by adjusting bias voltages for the lumped elements. In some approaches, the lumped elements include diodes or transistors.


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