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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10727559 B1

PDFFull Text
Expired
Date of Patent:
Jul. 28, 2020

Filed:

Aug. 02, 2018

Dielectric transmission medium comprising a plurality of rigid dielectric members coupled together in a ball and socket configuration

Applicant:

At&t Intellectual Property I, L.p., Atlanta, GA (US);

Inventors:

Paul Shala Henry, Holmdel, NJ (US);

William Scott Taylor, Norcross, GA (US);

Robert Bennett, Southold, NY (US);

Farhad Barzegar, Branchburg, NJ (US);

Irwin Gerszberg, Kendall Park, NJ (US);

Donald J. Barnickel, Flemington, NJ (US);

Thomas M. Willis, III, Tinton Falls, NJ (US);

Assignee:

AT&T Intellectual Property I, L.P., Atlanta, GA (US);

Attorneys:

Guntin & Gust, PLC

Andrew D. Raymond

Primary Examiner:

Benny T Lee

Int. Cl.
CPC ...
H01P 3/16 (2006.01); H01P 1/04 (2006.01); H01P 11/00 (2006.01); H01P 3/12 (2006.01); H04B 3/52 (2006.01); H04B 3/54 (2006.01); H01Q 1/50 (2006.01); H01P 3/06 (2006.01); H01P 1/02 (2006.01); H01P 1/06 (2006.01);
U.S. Cl.
CPC ...
H01P 3/16 (2013.01); H01P 1/042 (2013.01); H01P 3/06 (2013.01); H01P 3/122 (2013.01); H01P 11/006 (2013.01); H01Q 1/50 (2013.01); H04B 3/52 (2013.01); H04B 3/54 (2013.01); H01P 1/02 (2013.01); H01P 1/064 (2013.01);
Abstract

Aspects of the subject disclosure may include, for example, a transmission medium that includes a dielectric core comprising a plurality of rigid dielectric members configured to propagate guided electromagnetic waves. A dielectric cladding is disposed on at least a portion of an outer surface of the first dielectric core. Other embodiments are disclosed.

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Henry, Paul. (2020). Dielectric transmission medium comprising a plurality of rigid dielectric members coupled together in a ball and socket configuration (U.S. Patent No. 10727559). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10727559

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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