The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2020

Filed:

Feb. 26, 2019
Applicant:

Nichia Corporation, Anan-shi, Tokushima, JP;

Inventor:

Ryosuke Wakaki, Tokushima, JP;

Assignee:

NICHIA CORPORATION, Anan-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/32 (2010.01); H01L 33/52 (2010.01); H01L 33/38 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/32 (2013.01); H01L 33/38 (2013.01); H01L 33/52 (2013.01); H01L 2933/0066 (2013.01);
Abstract

According to one embodiment, a light emitting device includes a first lead, a light emitting element, and a first bonding member. The light emitting element includes a semiconductor stacked body and a first electrode. The semiconductor stacked body includes a light emitting layer. The first electrode is below the semiconductor stacked body. The first bonding member electrically connects the first lead and the first electrode. A lower surface of the first electrode includes a first protrusion, a second protrusion, and a first depression. The first depression is located between the first and second protrusions. The first protrusion has a first side surface. The second protrusion has a second side surface facing the first side surface. The first bonding member contacts at least a part of the first side surface. At least a part of the second side surface is separated from the first bonding member.


Find Patent Forward Citations

Loading…