The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2020
Filed:
Sep. 10, 2018
Seoul Viosys Co., Ltd, Ansan-si, KR;
Chi Hyun In, Ansan-si, KR;
Jun Yong Park, Ansan-si, KR;
Kyu Ho Lee, Ansan-si, KR;
Dae Woong Suh, Ansan-si, KR;
Jong Hyeon Chae, Ansan-si, KR;
Chang Hoon Kim, Ansan-si, KR;
Sung Hyun Lee, Ansan-si, KR;
Seoul Viosys Co., Ltd., Ansan-si, KR;
Abstract
Disclosed herein are a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes: a substrate, a light-emitting layer disposed on a surface of the substrate and including a first type semiconductor layer, an active layer, and a second type semiconductor layer, a first bump disposed on the first type semiconductor layer and a second bump disposed the second type semiconductor layer, a protective layer covering at least the light-emitting layer, and a first bump pad and a second bump pad disposed on the protective layer and connected to the first bump and the second bump, respectively.