The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2020

Filed:

Jan. 17, 2017
Applicant:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventors:

Hirofumi Nagano, Fujisawa Kanagawa, JP;

Koichi Ozaki, Kawasaki Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/06 (2006.01); H01L 29/10 (2006.01); H01L 21/324 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7816 (2013.01); H01L 21/3247 (2013.01); H01L 29/0607 (2013.01); H01L 29/0653 (2013.01); H01L 29/0657 (2013.01); H01L 29/1095 (2013.01); H01L 29/66659 (2013.01); H01L 29/66681 (2013.01); H01L 29/7835 (2013.01); H01L 29/0696 (2013.01); H01L 29/1045 (2013.01);
Abstract

According to one embodiment, a semiconductor device includes a semiconductor device includes a first semiconductor region, a second semiconductor region, a third semiconductor region, an insulating unit, a void, a gate insulating film and a gate electrode. The second semiconductor region provides on a part of the first semiconductor region. The third semiconductor region provides on one other part of the first semiconductor region. The insulating unit provides on a part of the second semiconductor region. The void provides at a lower part of the insulating unit. The gate insulating film provides on a part of the first semiconductor region between the second semiconductor region and the third semiconductor region. The gate electrode provides on the gate insulating film. A position in a first direction of at least a part of the void is between the insulating unit and the third semiconductor region.


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