The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2020

Filed:

Oct. 15, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Praveen Joseph, Albany, NY (US);

Xuefeng Liu, Schenectady, NY (US);

Gauri Karve, Cohoes, NY (US);

Eric Raymond Evarts, Niskayuna, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/22 (2006.01); H01L 43/02 (2006.01); H01L 43/08 (2006.01); H01L 43/10 (2006.01); H01L 43/12 (2006.01);
U.S. Cl.
CPC ...
H01L 27/228 (2013.01); H01L 43/02 (2013.01); H01L 43/08 (2013.01); H01L 43/10 (2013.01); H01L 43/12 (2013.01);
Abstract

A MRAM-TFT unit cell and a method for fabricating the same. The MRAM-TFT unit cell includes a MRAM device and a TFT device electrically coupled to the MRAM device. The MRAM device and the TFT device are situated within a common plane of the MRAM-TFT cell. The method includes forming a TFT device comprising a source/drain region, and a semiconducting layer on a substrate. A magnetic tunnel junction stack (MTJ) is formed in contact with the source region. A first contact is formed on the MTJ, and a second contact is formed on the drain region. A first interconnect metal layer is formed in contact with the first contact, and a second first interconnect metal layer is formed in contact with the second contact. A third contact is formed on a gate region of the TFT device. A third interconnect metal layer is formed in contact with the third contact.


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