The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2020

Filed:

May. 21, 2018
Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Inventors:

Tomohiro Iguchi, Kawasaki, JP;

Akiya Kimura, Yokohama, JP;

Akihiro Sasaki, Shinagawa, JP;

Assignee:

KABUSHIKI KAISHA TOSHIBA, Minato-ku, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/07 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/04 (2006.01); H01L 23/367 (2006.01); H01L 25/18 (2006.01); H01L 23/24 (2006.01); H01L 23/498 (2006.01); H01L 21/66 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 25/072 (2013.01); H01L 23/04 (2013.01); H01L 23/24 (2013.01); H01L 23/3121 (2013.01); H01L 23/3675 (2013.01); H01L 23/5386 (2013.01); H01L 24/05 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/18 (2013.01); H01L 22/32 (2013.01); H01L 23/3135 (2013.01); H01L 23/3735 (2013.01); H01L 23/49811 (2013.01); H01L 23/49866 (2013.01); H01L 24/03 (2013.01); H01L 24/06 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05016 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract

According to one embodiment, a semiconductor device includes a first semiconductor element, a first element insulating part, and an insulating sealing member. The first semiconductor element includes a first semiconductor chip and a first chip electrode electrically connected to the first semiconductor chip. The first semiconductor chip has a first surface crossing a first direction, a second surface crossing the first direction and distant from the first surface, and a third surface between the first and second surfaces. The first chip electrode is disposed on the first surface. The first element insulating part includes a first portion and a second portion continuous to the first portion. The insulating sealing member includes a third portion and a fourth portion continuous to the third portion. The first portion is between the first surface and the third portion, and the second portion is between the third surface and the fourth portion.


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