The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2020
Filed:
Jul. 03, 2017
Agency for Science, Technology and Research, Singapore, SG;
Boo Yang Jung, Singapore, SG;
Jason Au, Singapore, SG;
Agency for Science, Technology and Research, Singapore, SG;
Abstract
Various embodiments may provide a method of forming a semiconductor packaging structure. The method may include forming a plurality of semiconductor packages, each semiconductor package including a semiconductor die and a mold encapsulation structure. The method may also include arranging the plurality of semiconductor packages to form a vertical stacked arrangement with a mold portion including a plurality of mold encapsulation structures, the mold portion extending from a first side to a second side of the vertical stacked arrangement opposite the first side. The method may additionally include forming a first via on the mold portion at the first side of the vertical stacked arrangement, forming a second via on the mold portion at the second side of the vertical stacked arrangement, and forming an electrically conductive filled via extending through the mold portion from the first side to the second side of the vertical stacked arrangement.