The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2020
Filed:
Oct. 25, 2018
Shenzhen Goodix Technology Co., Ltd., Guangdong, CN;
Junping Luo, Guangdong, CN;
SHENZHEN GOODIX TECHNOLOGY CO., LTD., Shenzhen, CN;
Abstract
A chip packaging structure comprises a die, a carrier, a die attach film, and a plastic package body. The die attach film is disposed on the bottom surface of the die, with a thickness of the die attach film being greater than or equal to 40 micrometers. The die is disposed on the carrier via the die attach film; and the plastic package body is disposed on the carrier and coats a top surface and side surfaces of the die, whereby the overall impact resistance of a chip is improved without changing the structure of the carrier, the expense for making a mold is saved, and moreover, the packaging structure is simple and easy for mass production.