The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2020

Filed:

Dec. 07, 2017
Applicants:

Hyundai Motor Company, Seoul, KR;

Kia Motors Corporation, Seoul, KR;

Inventors:

Jun Hee Park, Hwaseong-si, KR;

Hyeon Uk Kim, Hwaseong-si, KR;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/492 (2006.01); H01L 23/051 (2006.01); H01L 21/50 (2006.01); H01L 23/473 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 21/50 (2013.01); H01L 23/051 (2013.01); H01L 23/473 (2013.01); H01L 23/492 (2013.01); H01L 23/4951 (2013.01); H01L 23/49513 (2013.01); H01L 23/49527 (2013.01); H01L 23/49537 (2013.01); H01L 23/49548 (2013.01); H01L 23/49558 (2013.01); H01L 23/49568 (2013.01); H01L 23/49586 (2013.01); H01L 24/33 (2013.01); H01L 23/10 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32257 (2013.01); H01L 2224/32258 (2013.01); H01L 2224/33181 (2013.01); H01L 2924/15153 (2013.01);
Abstract

A power module includes an upper substrate comprising a plurality of circuit pattern areas made of a metal and a dielectric area disposed between each of the plurality of circuit pattern areas; a lower substrate including a plurality of circuit pattern areas made of a metal and a dielectric area disposed between each of the plurality of circuit pattern areas; and a semiconductor element having an upper terminal and a lower terminal, the upper terminal and the lower terminal being bonded to a lower surface of the upper substrate and an upper surface of the lower substrate, respectively.


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