The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2020
Filed:
Sep. 15, 2014
Applicant:
Nxp B.v., Eindhoven, NL;
Inventors:
Bodin Kasemset, Bangkok, TH;
Peeradech Khunpukdee, Bangkok, TH;
Krassavan Tantirittisak, Bangkok, TH;
Assignee:
NXP B.V., Eindhoven, NL;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49503 (2013.01); H01L 23/495 (2013.01); H01L 23/49531 (2013.01); H01L 23/49551 (2013.01); H01L 23/49575 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/48 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83205 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15321 (2013.01); H01L 2924/181 (2013.01);
Abstract
Consistent with an example embodiment, there is a package assembly structure. The structure comprises a lead frame having a topside surface and an opposite under-side surface; the lead frame includes a die attach paddle, wherein a die attach region is defined on the opposite under-side surface. Pad landings surround the die attach region. A plurality of locking pins are arranged at predetermined locations about the die attach paddle, on the top side surface. The plurality of locking pins may be formed integrally in the lead frame and project upward from the top side surface.