The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2020

Filed:

Mar. 08, 2016
Applicant:

Teledyne Scientific & Imaging, Llc, Thousand Oaks, CA (US);

Inventors:

Steve Qingjun Cai, Newbury Park, CA (US);

Chung-Lung Chen, Thousand Oaks, CA (US);

Chialun Tsai, Thousand Oaks, CA (US);

Assignee:

TELEDYNE SCIENTIFIC & IMAGING, LLC, Thousand Oaks, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28D 15/02 (2006.01); H01L 23/427 (2006.01); B23P 15/26 (2006.01); F28D 15/04 (2006.01); H01L 21/48 (2006.01); H05K 3/22 (2006.01); F28F 21/04 (2006.01);
U.S. Cl.
CPC ...
H01L 23/427 (2013.01); B23P 15/26 (2013.01); F28D 15/0266 (2013.01); F28D 15/0283 (2013.01); F28D 15/046 (2013.01); F28F 21/04 (2013.01); H01L 21/4882 (2013.01); H05K 3/22 (2013.01); H01L 2924/0002 (2013.01); Y10T 29/49352 (2015.01); Y10T 29/49353 (2015.01); Y10T 156/10 (2015.01);
Abstract

A system and method is disclosed for fabricating a heat spreader system, including providing a plurality of bottom microporous wicks recessed in a bottom substrate, bonding a center substrate to the bottom substrate, and bonding a top substrate having a top chamber portion to the center substrate to establish a first vapor chamber with said plurality of bottom microporous wicks.


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