The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2020
Filed:
Oct. 29, 2018
Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;
TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota-shi, JP;
Abstract
A semiconductor device may include a semiconductor element including a signal pad, an encapsulant encapsulating the semiconductor element and a lead including a first end located outside the encapsulant and a second end located within the encapsulant. The lead may be connected to the signal pad via a bonding wire within the encapsulant. The lead may include an upper surface extending from the first end to the second end. The upper surface may include a joined section where the bonding wire is joined and a rough section located within the encapsulant and having a higher surface roughness than the joined section. The rough section may be at least partly located lower than the joined section.