The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2020

Filed:

Nov. 30, 2016
Applicant:

Kunshan New Flat Panel Display Technology Center Co., Ltd., Jiangsu, CN;

Inventors:

Xiuyu Zhang, Jiangsu, CN;

Baoyou Wang, Jiangsu, CN;

Pengle Dang, Jiangsu, CN;

Liwei Ding, Jiangsu, CN;

Xiaobao Zhang, Jiangsu, CN;

Hui Zhu, Jiangsu, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/77 (2017.01); H01L 23/31 (2006.01); H01L 27/12 (2006.01); G09F 9/30 (2006.01); G02F 1/1345 (2006.01); G02F 1/1333 (2006.01);
U.S. Cl.
CPC ...
H01L 21/77 (2013.01); G02F 1/13454 (2013.01); G02F 1/133305 (2013.01); G09F 9/301 (2013.01); H01L 23/3135 (2013.01); H01L 27/12 (2013.01); G02F 2201/50 (2013.01); G02F 2202/023 (2013.01);
Abstract

A bonding structure for a flexible screen and a manufacturing method are provided a flexible screen and a chip mounted on a surface of the flexible screen are arranged on the bonding structure for the flexible screen, and a bonding area for bonding the chip is arranged on the flexible screen, and a flexible protective layer is coated in the bonding area, and the flexible protective layer surrounds around the chip. Compared with the prior art, by forming the flexible protective layer with different hardness around the chip, the stress generated around the chip during the peeling-off are greatly dispersed, a stress gradient is formed, the stress concentration at the position closely adjacent to the periphery of the chip is avoided, the risk of the circuits around the chip being pulled broken can be reduced, and the peeling-off yield of the flexible screen can be finally increased.


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