The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2020
Filed:
Jul. 30, 2018
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Paul Merle Emerson, Madison, AL (US);
Benjamin Stassen Cook, Addison, TX (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 27/02 (2006.01); H01L 21/66 (2006.01); H01L 21/78 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76838 (2013.01); H01L 21/76801 (2013.01); H01L 21/78 (2013.01); H01L 22/12 (2013.01); H01L 22/14 (2013.01); H01L 23/5223 (2013.01); H01L 23/5227 (2013.01); H01L 23/5228 (2013.01); H01L 27/0207 (2013.01);
Abstract
Electronic device manufacturing and configuration methods include performing an additive deposition process that deposits a conductive, resistive, magnetic, semiconductor and/or thermally conductive material over a surface of a processed wafer metallization structure to set or adjust a circuit of a capacitor, an inductor, a resistor, an antenna and/or a thermal component of the metallization structure.