The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10726321 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 28, 2020

Filed:

Sep. 12, 2016
Applicant:

Zwipe As, Oslo, NO;

Inventors:

Devin Snell, Colorado Springs, CO (US);

Jose Ignacio Wintergerst Lavin, Colorado Springs, CO (US);

Assignee:

Zwipe AS, Oslo, NO;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/077 (2006.01); G06K 19/07 (2006.01); B32B 37/12 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
G06K 19/0773 (2013.01); B32B 37/1284 (2013.01); G06K 19/0718 (2013.01); G06K 19/07722 (2013.01); G06K 19/07747 (2013.01); G06K 19/07749 (2013.01); G06K 19/07754 (2013.01); G06K 19/07769 (2013.01); H05K 1/182 (2013.01);
Abstract

A method of manufacturing a smartcard may include providing a flexible smartcard circuit, forming conductive extension members on and extend away from the flexible circuit from a high melting point solder material, and laminating the flexible circuit to form a smartcard body. A cavity is then milled in the smartcard body to expose the ends of the extension members, and a contact pad is inserted into the cavity and electrically connected to extension members using a low melting temperature tin-bismuth solder using ultrasonically soldering, so as to avoid heat damage to the card body.


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