The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2020

Filed:

Oct. 09, 2017
Applicants:

Zachary Serpas Leonard, Magnolia, TX (US);

John Wakefield, Cypress, TX (US);

Inventors:

Zachary Serpas Leonard, Magnolia, TX (US);

John Wakefield, Cypress, TX (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
E21B 29/02 (2006.01); E21B 33/12 (2006.01); C22C 30/00 (2006.01); C22C 21/00 (2006.01); C22C 22/00 (2006.01); C22C 5/04 (2006.01); E21B 34/14 (2006.01); E21B 33/134 (2006.01);
U.S. Cl.
CPC ...
E21B 29/02 (2013.01); C22C 5/04 (2013.01); C22C 21/00 (2013.01); C22C 22/00 (2013.01); C22C 30/00 (2013.01); E21B 33/12 (2013.01); E21B 33/1208 (2013.01); E21B 33/134 (2013.01); E21B 34/14 (2013.01);
Abstract

A disintegrable downhole article comprises an electrolytically degradable metallic matrix and an energetic material comprising a first metal and a second metal that is in physical contact with the first metal. The first metal and the second metal are selected such that the first metal reacts with the second metal to generate an alloy, an intermetallic compound, heat, or a combination comprising at least one of the foregoing when electrically actuated. A method of controllably removing a disintegrable downhole article comprises disposing the downhole article in a downhole environment; performing a downhole operation; electrically actuating the energetic material; and disintegrating the downhole article.


Find Patent Forward Citations

Loading…