The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2020
Filed:
Aug. 02, 2018
Applicant:
Tatsuta Electric Wire & Cable Co., Ltd., Higashiosaka-shi, Osaka, JP;
Inventors:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO., LTD., Osaka, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); C09J 9/02 (2006.01); C09J 11/04 (2006.01); C09J 175/06 (2006.01); H01B 1/22 (2006.01); H05K 1/02 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C09J 11/04 (2013.01); C09J 175/06 (2013.01); H01B 1/22 (2013.01); H05K 1/0216 (2013.01); H05K 1/0281 (2013.01); H05K 1/18 (2013.01); H05K 9/0083 (2013.01); H05K 9/0088 (2013.01); H05K 2201/0715 (2013.01); H05K 2201/10371 (2013.01);
Abstract
A conductive adhesive contains a thermosetting resin (A), a conductive filler (B), and a filling-performance improver (C). The thermosetting resin (A) contains a first resin component (A1) having a first functional group, and a second resin component (A2) having a second functional group that reacts with the first functional group. The filling-performance improver (C) contains an organic salt. The conductive adhesive contains from 40 to 140 parts by mass of the filling-performance improver (C) relative to 100 parts by mass of the thermosetting resin.