The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2020
Filed:
May. 05, 2017
Applicant:
Sciosense B.v., AE Eindhoven, NL;
Inventors:
Harald Etschmaier, Graz, AT;
Anderson Singulani, Graz, AT;
Assignee:
Sciosense B.V., AE Eindhoven, NL;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B81B 3/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0048 (2013.01); B81B 3/0021 (2013.01); B81B 7/0058 (2013.01); B81B 2201/02 (2013.01); B81B 2201/0264 (2013.01); B81B 2201/0292 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/051 (2013.01);
Abstract
A sensor assembly for being mounted on a circuit board comprises an interposer with at least one opening extending between a first and a second main surface of the interposer. The interposer comprises at least two stress decoupling elements, each comprising a flexible structure formed by a respective portion of the interposer being partially enclosed by one of the at least one opening. A sensor die is connected to the flexible structures on the first main surface. At least two board connection elements are arranged on the first main surface and adapted for connecting the assembly to the circuit board.