The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2020

Filed:

May. 23, 2012
Applicants:

Lay-lay Chua, Singapore, SG;

Peter Ho, Singapore, SG;

Rui-qi Png, Singapore, SG;

Fong Yu Kam, Singapore, SG;

Jie Song, Singapore, SG;

Loke-yuen Wong, Singapore, SG;

Jing-mei Zhuo, Singapore, SG;

Kian Ping Loh, Singapore, SG;

Geok Kieng Lim, Singapore, SG;

Inventors:

Lay-Lay Chua, Singapore, SG;

Peter Ho, Singapore, SG;

Rui-Qi Png, Singapore, SG;

Fong Yu Kam, Singapore, SG;

Jie Song, Singapore, SG;

Loke-Yuen Wong, Singapore, SG;

Jing-Mei Zhuo, Singapore, SG;

Kian Ping Loh, Singapore, SG;

Geok Kieng Lim, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23B 37/00 (2006.01); B32B 37/00 (2006.01); H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
B32B 37/025 (2013.01); H01L 21/2007 (2013.01); Y10T 428/30 (2015.01);
Abstract

The present invention discloses a method for transferring a thin film from a first substrate to a second substrate comprising the steps of: providing a transfer structure and a thin film provided on a surface of a first substrate, the transfer structure comprising a support layer and a film contact layer, wherein the transfer structure contacts the thin film; removing the first substrate to obtain the transfer structure with the thin film in contact with the film contact layer; contacting the transfer structure obtained with a surface of a second substrate; and removing the film contact layer, thereby transferring the thin film onto the surface of the second substrate.


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