The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2020

Filed:

Oct. 04, 2017
Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Ji Ho Yun, Daejeon, KR;

Jae Young Jang, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 2/16 (2006.01); H01M 2/18 (2006.01); B26F 1/14 (2006.01); H01M 2/30 (2006.01); H01M 2/02 (2006.01); H01M 10/0525 (2010.01);
U.S. Cl.
CPC ...
B26F 1/14 (2013.01); H01M 2/0212 (2013.01); H01M 2/30 (2013.01); H01M 10/0525 (2013.01); H01M 2220/30 (2013.01);
Abstract

A lead processing apparatus includes a fixing die configured to maintain a position of a preliminary lead when a portion to be removed of the preliminary lead protrudes from a first end that is one side end and a cutting jig is configured to form the preliminary lead into an electrode lead shape by removing the portion to be cut except for a portion of the preliminary lead coupled to the fixing die, while being actuated in a downward direction with respect to the fixing die. In particular, each of corners of the first end has a round shape on a plane. A portion of the cutting jig, configured to cross the first end during the removal process (e.g., cutting) is performed by actuation in the downward direction is recessed in correspondence to the shape of the first end.


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