The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2020

Filed:

Apr. 06, 2017
Applicant:

Jtekt Corporation, Osaka-shi, JP;

Inventors:

Yoshinori Imoto, Kariya, JP;

Takaya Nagahama, Obu, JP;

Koichi Shiiba, Nisshin, JP;

Assignee:

JTEKT CORPORATION, Osaka-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/211 (2014.01); B23K 26/323 (2014.01); H01L 21/48 (2006.01); B23K 26/70 (2014.01); C23C 26/00 (2006.01); B23K 26/34 (2014.01); B23K 26/06 (2014.01); B23K 26/60 (2014.01); B23K 26/244 (2014.01); B23K 26/03 (2006.01); B23K 101/40 (2006.01); B23K 103/12 (2006.01); B23K 103/18 (2006.01);
U.S. Cl.
CPC ...
B23K 26/211 (2015.10); B23K 26/032 (2013.01); B23K 26/0626 (2013.01); B23K 26/244 (2015.10); B23K 26/323 (2015.10); B23K 26/34 (2013.01); B23K 26/60 (2015.10); B23K 26/707 (2015.10); C23C 26/00 (2013.01); H01L 21/4825 (2013.01); B23K 26/0643 (2013.01); B23K 2101/40 (2018.08); B23K 2103/12 (2018.08); B23K 2103/18 (2018.08);
Abstract

A bonding method includes: an oxide-film forming step, on an irradiated surface, an oxide film having a film thickness corresponding to a first output and an irradiation time of an oxide-film-forming laser beam; a first reflected-laser-beam detection step of detecting a second output; a first absorptance computing step of computing a first absorptance for the oxide-film-forming laser beam; laser-beam switching step of switching the oxide-film-forming laser beam radiated onto the irradiated surface to a heat-bonding laser beam; and a heat bonding step of heating a first bonding surface until the temperature thereof reaches a predetermined bonding temperature, and bonding the first bonding surface to a second bonding surface.


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