The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2020
Filed:
Dec. 20, 2016
Ford Global Technologies, Llc, Dearborn, MI (US);
S. George Luckey, Jr., Dearborn, MI (US);
Feng Ren, West Bloomfield, MI (US);
Daniel Quinn Houston, Dearborn, MI (US);
Ford Global Technologies, LLC, Dearborn, MI (US);
Abstract
Dies for forming components, such as sheet components, and methods of producing the dies are disclosed. The die may include a bulk material and a forming surface. A solid conductor may be formed in the bulk material. The solid conductor may be spaced from and extend adjacent to the forming surface and have a melting point that is greater than a melting point of the bulk material. The solid conductor may be configured to absorb heat from the forming surface. There may multiple solid conductors within the bulk material, for example spaced apart and extending along an axis. The solid conductor may be a bundle of carbon fibers, which may be pitch-based. The solid conductor may be conformal to the forming surface, for example, having a constant spacing therefrom. The solid conductor may be cast-in to the die during its production.