The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2020
Filed:
Dec. 21, 2017
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Eiji Osawa, Suwa, JP;
Chikara Kojima, Matsumoto, JP;
Assignee:
Seiko Epson Corporation, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B06B 1/06 (2006.01); A61B 8/00 (2006.01); A61B 8/15 (2006.01); A61B 8/08 (2006.01); A61B 5/00 (2006.01); A61B 8/13 (2006.01);
U.S. Cl.
CPC ...
A61B 8/4494 (2013.01); A61B 8/15 (2013.01); B06B 1/0622 (2013.01); A61B 5/0035 (2013.01); A61B 8/08 (2013.01); A61B 8/0833 (2013.01); A61B 8/13 (2013.01); A61B 8/4444 (2013.01); A61B 8/56 (2013.01); G01N 2291/106 (2013.01);
Abstract
An ultrasonic device includes a substrate that is provided with an opening and a partition wall surrounding the opening, a vibration portion that closes one end side of the opening, and a piezoelectric element that is provided in the vibration portion, in which, in a case where an opening width dimension of the opening is indicated by W, and a thickness dimension of the substrate is indicated by H, a ratio W/H is 0.66 to 0.92.