The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2020
Filed:
Aug. 26, 2015
Fukuoka University, Fukuoka, JP;
Zuken, Inc., Kanagawa, JP;
Fuji Corporation, Aichi, JP;
Hioki E. E. Corporation, Nagano, JP;
Hajime Tomokage, Fukuoka, JP;
Yoshihisa Katoh, Fukuoka, JP;
Hidemichi Kawase, Tokyo, JP;
Hiroshi Matsuoka, Tokyo, JP;
Hirohiko Matsuzawa, Kanagawa, JP;
Kazuhiro Kusunoki, Aichi, JP;
Hiroshi Yamazaki, Nagano, JP;
Abstract
Provided is a manufacturing apparatus that manufactures a high-quality manufacturing object by using component information per unit of individual electronic component or per unit of package in a plurality of electronic components that have been packaged. The manufacturing apparatus is a manufacturing apparatus that manufactures a product by taking out each electronic component from packaged components in which a plurality of electronic components are packaged. The manufacturing apparatus is provided with: a component information reading unit that reads component information per unit of electronic component or per unit of package in the packaged components; a manufacturing control unit that controls, using the read component information, the manufacturing treatment of product into which electronic components indicated in the component information are incorporated; and an incorporation information generating unit that generates incorporation information regarding a state of incorporation of each electronic component in the product.