The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2020

Filed:

May. 02, 2018
Applicant:

Medtronic, Inc., Minneapolis, MN (US);

Inventors:

Songhua Shi, Tempe, AZ (US);

Darrin T. Schauble, Phoenix, AZ (US);

Rachel M. Day, Tempe, AZ (US);

Assignee:

Medtronic, Inc., Minneapolis, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H01R 12/57 (2011.01); H05K 5/06 (2006.01); A61B 5/0492 (2006.01); H05K 5/02 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0069 (2013.01); A61B 5/0492 (2013.01); H01R 12/57 (2013.01); H05K 5/0247 (2013.01); H05K 5/064 (2013.01); A61B 2562/125 (2013.01);
Abstract

In some examples, a medical device may include circuitry on a circuit board, a casing, and a fill material at least partially within the casing. The casing may receive the circuit board and surround at least a portion of the circuit board. The casing may define an aperture configured to allow one or more electrical connectors of the circuit board to extend through the aperture for one or more electrical connections with one or more components outside of the casing. An outer surface of the casing may define a first portion of an outer surface of the medical device. The casing may comprise a material having a first melting temperature. The fill material may define a second portion of the outer surface of the medical device and may have a second melting temperature that is lower than the first melting temperature.


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