The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2020

Filed:

Mar. 16, 2017
Applicant:

Endress+hauser Se+co. KG, Maulburg, DE;

Inventors:

Romuald Girardey, Blotzheim, FR;

Dietmar Birgel, Schopfheim, DE;

Armend Zenuni, Lörrach, DE;

Marc Baret, Kembs, FR;

Peter Klöfer, Steinen, DE;

Assignee:

Endress+Hauser SE+Co. KG, Maulburg, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/14 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 1/141 (2013.01); H05K 3/368 (2013.01); H05K 2201/044 (2013.01); H05K 2201/0999 (2013.01); H05K 2201/09754 (2013.01);
Abstract

The present disclosure relates to a method for positioning at least two circuit boards in a housing having a non-conductive surface, a first securement location for securing the first circuit board, and a second securement location for securing the second circuit board, wherein at least one conductive trace is arranged in the housing and is connected non-releasably with the housing, and wherein the conductive trace electrically contacts the first securement location with the second securement location, the method comprising securing the circuit boards in the securement locations of the housing such that the first circuit board is electrically in contact with the first securement location and the second circuit board is electrically in contact with the second securement location, wherein the first circuit board and the second circuit board are electrically in contact with one another via the at least one conductive trace.


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