The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2020

Filed:

Mar. 19, 2019
Applicant:

Visteon Global Technologies, Inc., Van Buren Township, MI (US);

Inventors:

Thorsten Wilmer, Bruchsal, DE;

Thomas Kopfstedt, Karlsruhe, DE;

Kai Wang, Ettlingen, DE;

Assignee:

Visteon Global Technologies, Inc., Van Buren Township, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H01R 12/73 (2011.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H01R 12/73 (2013.01); H05K 1/11 (2013.01); H05K 1/141 (2013.01); H05K 1/181 (2013.01); H05K 2201/044 (2013.01);
Abstract

Various systems may benefit from suitable arrangements and configurations of modules. For example, certain electronics systems may benefit from systems and methods for stacking electronic modules on a base board. A system of stacking computer modules can include a base board, which can be a printed circuit board (PCB). The system can also include a first plurality of connectors, mounted to and in electrical communication with the base board. The system can further include a first module, the first module including a second PCB and a second plurality of bottom connectors configured to engage the first plurality of connectors and a third plurality of top connectors. The system can additionally include a second module, the second module including a third PCB and a fourth plurality of bottom connectors configured to engage the third plurality of top connectors of the first module.


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