The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2020

Filed:

Nov. 28, 2018
Applicant:

Lextar Electronics Corporation, Hsinchu, TW;

Inventors:

Hung-Chun Tong, New Taipei, TW;

Chang-Zhi Zhong, Hsinchu County, TW;

Fu-Hsin Chen, Hsinchu County, TW;

Yu-Chun Lee, Hsinchu County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/50 (2010.01); H01L 33/54 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 33/20 (2010.01); H01L 33/00 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H01L 33/502 (2013.01); H01L 33/005 (2013.01); H01L 33/20 (2013.01); H01L 33/60 (2013.01); H01L 33/644 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01);
Abstract

A light emitting diode device includes a light emitting diode chip, a wavelength conversion layer including a bottom surface facing a top surface of the light emitting diode chip, and an interlayer having a first portion between the light emitting diode chip and a part of the bottom surface of the wavelength conversion layer, and a second portion extending from the first portion and connected between a remaining part of the bottom surface of the wavelength conversion layer and a side surface of the light emitting diode chip. The second portion has a side surface including a linear surface substantially aligning with a side surface of the wavelength conversion layer, and a curved surface having a first end connected to the linear surface and a second end connected to the side surface of the light emitting diode chip. The linear surface and the curved surface define a chamfer angle.


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