The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2020

Filed:

May. 24, 2019
Applicant:

Nikkiso Co., Ltd., Tokyo, JP;

Inventors:

Haruhito Sakai, Hakusan, JP;

Noritaka Niwa, Hakusan, JP;

Tetsuhiko Inazu, Hakusan, JP;

Assignee:

NIKKISO CO., LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/14 (2010.01); H01L 33/32 (2010.01); H01L 33/36 (2010.01); H01L 21/28 (2006.01); H01L 21/3065 (2006.01);
U.S. Cl.
CPC ...
H01L 33/007 (2013.01); H01L 21/28 (2013.01); H01L 21/3065 (2013.01); H01L 33/145 (2013.01); H01L 33/32 (2013.01); H01L 33/36 (2013.01); H01L 2933/0016 (2013.01);
Abstract

A method of manufacturing a semiconductor light emitting device includes: forming an active layer of an aluminum gallium nitride (AlGaN)-based semiconductor material on an n-type clad layer of an n-type AlGaN-based semiconductor material; forming a p-type semiconductor layer on the active layer; removing portions of the p-type semiconductor layer, the active layer, and the n-type clad layer so as to expose a partial region of the n-type clad layer; and forming an n-side electrode on the partial region of the n-type clad layer exposed. The removing includes first dry-etching performed by using both a reactive gas and an inert gas and second dry-etching performed after the first dry-etching by using a reactive gas.


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