The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2020

Filed:

Aug. 27, 2018
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventor:

Chang Seop Yoon, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 29/06 (2006.01); H01L 21/84 (2006.01); H01L 29/08 (2006.01); H01L 27/11 (2006.01); H01L 27/092 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1211 (2013.01); H01L 21/845 (2013.01); H01L 29/0649 (2013.01); H01L 29/0847 (2013.01); H01L 27/0924 (2013.01); H01L 27/1104 (2013.01);
Abstract

A semiconductor device includes a substrate including a lower substrate layer, a buried insulation layer on the lower substrate layer, and an upper substrate layer on the buried insulation layer, a first trench passing through the upper substrate layer, the buried insulation layer, and a portion of the lower substrate layer, a second trench passing through the upper substrate layer, the buried insulation layer, and a portion of the lower substrate layer and being spaced apart from the first trench, a field insulation layer in a portion of the first trench and in a portion of the second trench, and a first fin pattern defined by the first trench and the second trench. An upper surface of the field insulation layer is higher than an upper surface of the buried insulation layer.


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