The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2020
Filed:
Nov. 19, 2019
Texas Instruments Incorporated, Dallas, TX (US);
Lee Han Meng@ Eugene Lee, Johor, MY;
Anis Fauzi bin Abdul Aziz, Meleka, MY;
Khoo Yien Sien, Meleka, MY;
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Abstract
A semiconductor system () has a flat interposer () with a first surface () in a first plane, a second surface () in a parallel second plane, and a uniform first height () between the surfaces; the interposer is patterned in metallic zones separated by gaps (), the zones include metal of the first height and metal of a second height () smaller than the first height; an insulating material fills the gaps and the zone differences between the first and the second heights. Semiconductor chips of a first () and a second () set have first terminals attached to metallic zones of the first interposer surface while the chips of the second set have their second terminals facing away from the interposer. A first leadframe () is attached to the second terminals of the second set chips, and a second leadframe () is attached to respective metallic zones of the second interposer surface.