The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2020
Filed:
Nov. 09, 2016
Applicant:
Kyocera Corporation, Kyoto-shi, Kyoto, JP;
Inventors:
Takuji Okamura, Satsumasendai, JP;
Akihiko Funahashi, Kagoshima, JP;
Assignee:
KYOCERA CORPORATION, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 33/62 (2010.01); H01L 23/13 (2006.01); H01L 21/48 (2006.01); H01L 23/053 (2006.01); H01L 23/498 (2006.01); H04N 5/225 (2006.01); H01L 23/552 (2006.01); H01L 27/146 (2006.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/4817 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 23/053 (2013.01); H01L 23/13 (2013.01); H01L 23/4985 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 33/62 (2013.01); H01L 23/552 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 27/14618 (2013.01); H01L 33/486 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83862 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12043 (2013.01); H01L 2924/1576 (2013.01); H01L 2924/15159 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/16195 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/3512 (2013.01); H04N 5/2253 (2013.01);
Abstract
An electronic component mounting board includes an inorganic substrate, a wiring board, and a bond. The inorganic substrate includes an electronic component mounting portion in a central area of an upper surface of the inorganic substrate in which an electronic component is mountable. The wiring board is a frame surrounding the electronic component mounting portion on the upper surface of the inorganic substrate. The bond is located between the inorganic substrate and the wiring board. The inorganic substrate includes a downward bend outward from a bond area including the bond.