The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2020
Filed:
Jun. 13, 2018
Starlet R. Glover, Farmington, AR (US);
Sayan Seal, Fayetteville, AR (US);
H. Alan Mantooth, Fayetteville, AR (US);
Sayan Seal, Fayetteville, AR (US);
Michael D. Glover, Fayetteville, AR (US);
H. Alan Mantooth, Fayetteville, AR (US);
Other;
Abstract
A flip-chip wire bondless power device and method for using a two sided contact bare die power device as a single-connection-level power device. The device uses a top pad solder ball array for connecting a top pad electrically connected to the top contact of the bare die power device and a bottom pad solder ball array for connecting a bottom pad that is electrically through an electrically conductive bottom pad connector that is electrically connected to the bottom contact of the bare die power device using an electrically conductive die-attach material, the top pad and bottom pad, and thereby the top pad solder ball array and the bottom pad solder ball array are planar for flip chip mounting. A trench can be formed between the top pad and bottom pad for isolation and insulation purposes. A method of assembling a flip-chip wire bondless power device is also provided.