The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2020
Filed:
Jul. 20, 2016
Sumitomo Bakelite Co., Ltd., Tokyo, JP;
Shunsuke Mochizuki, Tokyo, JP;
Kazuya Kitagawa, Tokyo, JP;
Yoji Shirato, Tokyo, JP;
Keita Nagahashi, Tokyo, JP;
Mika Tsuda, Tokyo, JP;
Satoshi Maji, Tochigi, JP;
SUMITOMO BAKELITE CO., LTD., Tokyo, JP;
Abstract
A substrate for a power module () of the present invention includes a metal substrate (), an insulating resin layer () provided on the metal substrate (), and a metal layer () provided on the insulating resin layer (). The insulating resin layer () includes a thermosetting resin (A) and inorganic fillers (B) dispersed in the thermosetting resin (A), a maximum value of a dielectric loss ratio of the insulating resin layer () at a frequency of 1 kHz and 100° C. to 175° C. is equal to or less than 0.030, and a change in a relative permittivity is equal to or less than 0.10.