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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10718887 B1

PDFFull Text
Date of Patent:
Jul. 21, 2020

Filed:

Jan. 30, 2018

Method of manufacturing antireflection film and antireflection film

Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Ayako Matsumoto, Kanagawa, JP;

Daiki Wakizaka, Kanagawa, JP;

Shuntaro Ibuki, Kanagawa, JP;

Assignee:

FUJIFILM Corporation, Tokyo, JP;

Attorneys:

Jean C. Edwards, Esq.

Edwards Neils LLC

Primary Examiner:

Mustak Choudhury

Int. Cl.
CPC ...
G02B 27/00 (2006.01); G02B 1/118 (2015.01); B32B 7/02 (2019.01); G02B 1/14 (2015.01); B32B 3/26 (2006.01); B32B 27/20 (2006.01); B32B 3/30 (2006.01); B32B 27/06 (2006.01); G02B 1/04 (2006.01); B05D 5/06 (2006.01); B05D 3/06 (2006.01); B05D 3/02 (2006.01); B05D 1/28 (2006.01);
U.S. Cl.
CPC ...
G02B 1/118 (2013.01); B32B 3/26 (2013.01); B32B 3/30 (2013.01); B32B 7/02 (2013.01); B32B 27/06 (2013.01); B32B 27/20 (2013.01); G02B 1/04 (2013.01); G02B 1/14 (2015.01); B05D 1/28 (2013.01); B05D 3/0209 (2013.01); B05D 3/0254 (2013.01); B05D 3/065 (2013.01); B05D 5/06 (2013.01); B05D 2518/10 (2013.01); B05D 2601/22 (2013.01); B32B 2307/40 (2013.01); B32B 2307/538 (2013.01);
Abstract

The present invention provides a method of manufacturing an antireflection film, including the successive steps of: applying a composition including a curable compound (a1), a plurality of particles (a2), and a solvent on a substrate, and volatilizing the solvent to provide a layer (a), the layer (a) having a portion in which the particles (a2) do not exist, and the portion having a thickness being 0.8 times the average primary particle diameter of the particles (a2) or greater; curing a portion of the curable compound (a1); causing a portion of the curable compound (a1) to permeate the substrate or to be volatilized so as to form an uneven shape; and curing the curable compound (a1) remained in the layer (a).

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