The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2020
Filed:
Dec. 18, 2015
Applicant:
Nitta Corporation, Osaka-shi, Osaka, JP;
Inventors:
Hisashi Yamamoto, Yamatokooriyama, JP;
Masahiro Hatsuda, Yamatokooriyama, JP;
Mitsumasa Kitano, Yamatokooriyama, JP;
Tomohiro Agaya, Yamatokooriyama, JP;
Koji Iwata, Yamatokooriyama, JP;
Assignee:
NITTA CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L 19/00 (2006.01); G01K 7/18 (2006.01); G01K 7/16 (2006.01); G01K 1/26 (2006.01); G01K 1/02 (2006.01); G01L 9/00 (2006.01); G01K 15/00 (2006.01);
U.S. Cl.
CPC ...
G01L 19/0092 (2013.01); G01K 1/026 (2013.01); G01K 1/26 (2013.01); G01K 7/16 (2013.01); G01K 7/18 (2013.01); G01L 9/00 (2013.01); G01K 15/005 (2013.01);
Abstract
A sensor sheet is manufactured by forming a conductive heat-sensitive materialover first wiring electrodesand forming second wiring electrodesover the conductive heat-sensitive material. For this reason, no adhesion surface (boundary surface), which is formed when adhesion is performed later, exists between the first wiring electrodeand the conductive heat-sensitive materialand between the conductive heat-sensitive materialand the second wiring electrodes